SPUTTERING TARGETS FOR THE ELECTRONICS INDUSTRY

These targets provide consistent, reproducible process performance with high thickness uniformity and repeatable target-to-target sputtering deposition. The elimination of texture banding during fabrication produces a uniform microstructure, which delivers improved early-life stability and consistent-through-life sputter performance.

Ta 300mm SIP Rs Uniformity Comparison - TaN/Ta Bi Layer Film

With uniform microstructure and controlled texture, our fine grain 6N copper and copper alloy targets offer consistent performance and reliability, with increased target life. The well-controlled fine-grain microstructure enables innovative designs and higher yield strength allows for monobloc target structures, which exhibit minimal deflection and increased target life of up to 50%. 

Fine Grain 6N Cu Target Performance for 300mm Endura target

PROPERTY/CHARACTERISTICS	PRAXAIR’S PROPRIETARY PROCESS	STANDARD PROCESS
Grain Size	< 25µm	40-60 µm
Yield Strength	180 MPa	92 MPa
Tensile Strength	240 MPa	225 MPa
Target Life	2100 kWh	1300* kWh

* Process dependent

Praxair’s stable manufacturing process provides improved target-to-target microstructural consistency with 70% smaller grains, as compared to conventional processing. Reduced grain size increases your productivity by improving sputter consistency and film properties.

Using advanced metallurgical fabrication techniques, our aluminum and aluminum-copper (Al-0.5Cu) targets exhibit enhanced yield strengths, with a nominal grain size of 0.5 µm, compared to 40-50µm obtained through conventional processing. The improved yield strength permits single-piece designs, which extend the life of our targets.

Designed to improve the cost of ownership for aluminum deposition on 200mm wafers, the RE-Al â PLUS target demonstrates excellent performance throughout its rated lifetime of 1600 kWh (equivalent to 9,500 1-µm films).

When used with electrostatic chuck shield kits, the RE-Al â PLUS target can significantly increase the interval between kit and target replacements, allowing for increased tool utilization. In addition to the RE-Al â PLUS target, the RE-Al Supreme target is available with the same benefits for 150mm wafer processing. 

Alumina Doped Zinc Oxide (AZO) targets provide highly-effective transparent conducting oxide (TCO) layers for amorphous silicon and other thin-film photovoltaic devices. Targets are available in a tubular configuration to maximize material usage, yield and production time.

AZO Datasheet (623KB)

At Praxair, we offer a full line of high-purity metallic-oxide sputtering and laser ablation targets. Targets are processed from both single and multi-component oxide powders, which are optimized for the production of high-density targets. Each target can be designed with either indium/tin or silver epoxy bonding to customer specified backing plates or cups.

Our 4N5 nickel platinum targets were developed specifically for leading-edge salicide semiconductor applications. High purity and mechanical stability make them ideal for advanced device processing.

Production fab results indicate that target life extensions up to 65% are possible with Praxair’s recess embedded RE-Ti titanium targets. We can reduce your titanium target consumption by up to 40%, while still meeting all requirements for uniformity, particle generation and other film properties throughout target life.

In order to achieve optimal film properties and minimize particle generation, it is essential to control tungsten target purity, density, grain size and orientation. Through a tightly controlled manufacturing process, Praxair can deliver 5Ns (99.999%) pure W targets with a density greater than 99.7%. High-purity Ti-W, and W-Si targets are also available for semiconductor, solar and other thin film processes.